56 - Applications Reaching the Tipping Point, Semiconductors and Tungsten on the Rise, Costs Coming Down and More From Formnext 2024


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Dec 03 2024 62 mins   4

Formnext 2024 lived up to its reputation as additive manufacturing’s largest trade show, attracting more than 34,000 attendees to 54,000 m2 of exhibit space. It was also large in the sense of showcasing just how big 3D printing can go, with plenty of showpieces and demos running to illustrate the current scale of large-format additive manufacturing (LFAM) technology. But beneath the robotic arms and towering prints, there were also plenty of new machine introductions, software advances and application examples.

Over the course of their time at the show, AM Radio cohosts Peter Zelinski and Stephanie Hendrixson noted more semiconductor applications than ever before, an increased use of tungsten, software developments aimed at solving AM’s design bottleneck, various approaches to cutting cost per part, and indications that additive manufacturing has crossed various tipping points expanding where the production method makes sense, and is on trajectory to continue that advance. In this episode of the AM Radio podcast, hear observations from the show floor and takeaways for additive manufacturers.

Find photos, related links and the transcript for this episode on AdditiveManufacturing.Media.

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