Oct 24 2024 84 mins 2
Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies.
Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes.
Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.
John Lannon, general manager of Micross AIT talks about progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.
LPKF’s Richard Noack talks about the difference between glass interposers and glass core technology, and what’s driving development of these materials.
Sally Ann Henry, ACM Research, talks about the company’s decision to invest in equipment platforms to support panel level packaging.
Casey Krawiec, StratEdge Corporation, talks about what it means to receive the IMAPS Society Award for Corporate Sponsorship, and why he thinks it’s important to support these activities.
Habib Hichri, Ajinomoto Fine Techno, talks about his work with IMAPS Academy, and Ajinomoto’s new developments beyond ABF dielectric film to address advanced packaging substrate material needs.
Adeia’s Guilian Gao talks about what OSATS need to do to support die to wafer hybrid bonding processes.
Scott Sikorski, IBM, explains how the Northeast Corridor from New York up into Canada is becoming one of the U.S.’s hot spots in advanced packaging.
Peter Cronin, MRSI Micronic, introduces the company’s latest die bonders system, and talks about a new application center in Livermore
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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